Chipright
Guelph, ON, Canada
System In Package (SIP) Assembly Engineer Salary: Very Attractive Rate Location: N/A System In Package(SIP) Assembly EngineerThe assignmentDefining the package type with the customer and sub-contractor, technical support between customer and sub-contractor.Development of Modules, MCM, substrates for new type of packages together with our subco
Job Source: ChiprightCanadian Executive Search Group Inc.
Guelph, ON, Canada
AWS/CES is looking for a Project Engineer in (Guelph, ON) Salary: $90,000 – $100,000 per annum We are currently seeking a dynamic and forward-thinking Project Engineer to join our team in Guelph, ON. The ideal candidate should possess a range of experiences, with a focus on OEM exposure, machining, assembly, leak testing, and familiarity with BS
Job Source: Canadian Executive Search Group Inc.Canadian Executive Search Group Inc.
Guelph, ON, Canada
AWS/CES is looking for a Project Engineer in (Guelph, ON) Salary: $90,000 – $100,000 per annum We are currently seeking a dynamic and forward-thinking Project Engineer to join our team in Guelph, ON. The ideal candidate should possess a range of experiences, with a focus on OEM exposure, machining, assembly, leak testing, and familiarity with BS
Job Source: Canadian Executive Search Group Inc.3 Step Recruitment Inc.
Guelph, ON, Canada
A well-established manufacturing company located in Guelph, ON is in search of an adept Senior mechanical Engineer with a background in Automotive to join their team. The Engineer will be tasked with analyzing parts, drawings, specifications, and other engineering data to determine the operations necessary for product fabrication and assembly. Req
Job Source: 3 Step Recruitment Inc.3 Step Recruitment Inc.
Guelph, ON, Canada
A well-established manufacturing company located in Guelph, ON is in search of an adept Senior mechanical Engineer with a background in Automotive to join their team. The Engineer will be tasked with analyzing parts, drawings, specifications, and other engineering data to determine the operations necessary for product fabrication and assembly. Req
Job Source: 3 Step Recruitment Inc.Chipright
Guelph, ON, Canada
The Senior Test System Design Engineer positions will provide the successful candidate an opportunity to join a fast-growing team supporting the development and test of our client's 5G ORAN Radio Unit (O-RU) products. You will be working with the test lead to design, develop and continuously improve new and existing test processes in the company in
Job Source: ChiprightChipright
Guelph, ON, Canada
The Senior Test System Design Engineer positions will provide the successful candidate an opportunity to join a fast-growing team supporting the development and test of our client's 5G ORAN Radio Unit [O-RU] products. You will be working with the test lead to design, develop and continuously improve new and existing test processes in the company in
Job Source: ChiprightCastle Employment Agency Ltd
Pickering, ON, Canada
Are you a highly skilled Mechanical engineering professional seeking a new and exciting opportunity to utilise your expertise in a dynamic team? We are currently seeking a Mechanical Design Engineer to join a cutting-edge business, providing engineering design and support functions, and be responsible for small & large-scale projects. This is a hig
Job Source: Castle Employment Agency LtdGuelph, ON, Canada
System In Package (SIP) Assembly Engineer Salary: Very Attractive Rate
Location: N/A
System In Package(SIP) Assembly EngineerThe assignmentDefining the package type with the customer and sub-contractor, technical support between customer and sub-contractor.Development of Modules, MCM, substrates for new type of packages together with our subcontractor.Manage all package development activities including conceptual design, feasibility study, substrate fabrication, assembly.Organizing the flow of the volume production assembly.Discussing the potential yield and/or reliability issues, failure analysis, process improvements.Required knowledge and skillsYou have a Master’s degree (or higher) in Electronics, preferably with 3 to 7years of relevant experience in the areas of assembly.Knowledge of assembly manufacturing processes and assembly flow including SMT, die prep, die attach, flip chip, underfilling, wire bonding, molding, singulation and back-end processes.Familiar with BGA package substrate technologies.Experience in project-based work. You are pro-active and customer focused, like to take initiatives and you are very motivated to work within a team of engineers.Excellent communication skills that can enable the candidate to work well with internal cross functional teams and overseas suppliers, A good knowledge of English is mandatory.
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